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Effects of interface states and temperature on the C-V behavior of metal/insulator/AlGaN/GaN heterostructure capacitors

机译:界面状态和温度对金属/绝缘体/ AlGaN / GaN异质结构电容器C-V行为的影响

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摘要

The impact of states at the insulator/AlGaN interface on the capacitance-voltage (C-V) characteristics of a metal/insulator/AlGaN/GaN heterostructure (MISH) capacitor was examined using a numerical solver of a Poisson equation and taking into account the electron emission rate from the interface states. A parallel shift of the theoretical C-V curves, instead of the typical change in their slope, was found for a MISH device with a 25-nm-thick AlGaN layer when the SiNx/AlGaN interface state density Dit(E) was increased. We attribute this behavior to the position of the Fermi level at the SiNx/AlGaN interface below the AlGaN valence band maximum when the gate bias is near the threshold voltage and to the insensitivity of the deep interface traps to the gate voltage due to a low emission rate. A typical stretch out of the theoretical C-V curve was obtained only for a MISH structure with a very thin AlGaN layer at 300℃. We analyzed the experimental C-V characteristics from a SiNx/Al2O3/AlGaN/GaN structure measured at room temperature and 300℃, and extracted a part of Dit(E). The relatively low Dit (~1011 eV−1 cm−2) in the upper bandgap indicates that the SiNx/Al2O3 bilayer is applicable as a gate insulator and as an AlGaN surface passivant in high-temperature, high-power AlGaN/GaN-based devices.
机译:使用泊松方程的数值求解器并考虑了电子发射,研究了绝缘体/ AlGaN界面处的状态对金属/绝缘体/ AlGaN / GaN异质结构(MISH)电容器的电容-电压(CV)特性的影响接口状态的速率。当增加SiNx / AlGaN界面态密度Dit(E)时,对于具有25nm厚AlGaN层的MISH器件,发现了理论C-V曲线的平行移动,而不是其斜率的典型变化。我们将这种行为归因于当栅极偏置电压接近阈值电压时,SiNx / AlGaN界面的AlN价带最大值以下的SiNx / AlGaN界面的费米能级的位置,以及归因于低发射引起的深界面陷阱对栅极电压的不敏感性率。仅在300℃下,只有具有非常薄的AlGaN层的MISH结构才能获得理论C-V曲线的典型延伸。我们从室温和300℃下测量的SiNx / Al2O3 / AlGaN / GaN结构分析了实验C-V特性,并提取了一部分Dit(E)。较高的带隙中较低的Dit(〜1011 eV-1 cm-2)表示SiNx / Al2O3双层可用作高温高功率AlGaN / GaN基的栅绝缘体和AlGaN表面钝化剂设备。

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